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IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 397–408, Kuang J, Young E F Y. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. What Are The Benefits Of Design For Manufacturability. Aging-aware logic synthesis. Cite this article. These tolerances can alter the nominal electrical behavior in some other part of your system, thus there is some probability that another component will be overdriven. However, in order to perform reliably, the board must be well-manufactured. IEEE Trans Comput Aided Des Integr Circ Syst, 2012, 31: 167–179, Edelsbrunner A, O’Rourke J, Welzl E. Stationing guards in rectilinear art galleries. In: Proceedings of Symposium on VLSI Technology (VLSIT), Honolulu, 2012. Proc SPIE, 2011: 7973, Sahouria E, Bowhill A. Generalization of shot definition for variable shaped e-beam machines for write time reduction. This guarantees reliable, repeatable performance for WiSpry’s devices in wireless applications and beyond. A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. Proc SPIE, 2015: 9427, Kumar S V, Kim C H, Sapatnekar S. An analytical model for negative bias temperature instability. Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. J Appl Phys, 1999, 86: 3068–3075, Pak J, Lim S K, Pan D Z. Electromigration study for multiscale power/ground vias in TSV-based 3-D ICs. PARR: pin access planning and regular routing for self-aligned double patterning. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Grenoble, 2015. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. 1–12, Fang J X, Sapatnekar S S. Scalable methods for the analysis and optimization of gate oxide breakdown. DfM can reduce many reliability costs, since products can be quickly assembled from fewer parts. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. Design for Manufacturability with Advanced Lithography. Proc SPIE, 2006, 6283, Ma X, Jiang S L, Zakhor A. The conventional reliability aware … ). 493–496, Wang R S, Luo M L, Guo S F, et al. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. Manufacturability is in many ways dictated by a part’s design, and can have huge implications as to the cost and effectiveness of the end product. Self-aligned double and quadruple patterning-aware grid routing with hotspots control. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Austin, 2007. o Reliabilityis the measure of a product’s ability to o …perform the specified function o …at the customer (with their use environment) o …over the desired lifetime o Design for Reliabilityis a process for ensuring the reliability of a product or system during the design stage before physical prototype In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Taipei, 2010. Design for reliability ensures that products and systems perform a specified function within a given environment for an expected lifecycle. In addition, predictable development time, efficient manufacturing with high yields, and exemplary In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. The paradigm shift in understanding the bias temperature instability: from reaction–diffusion to switching oxide traps. Understanding soft errors in uncore components. J Micro/Nanolithogr MEMS MOEMS, 2015, 14: 011003, Matsunawa T, Gao J-R, Yu B, et al. There are many factors influencing the product design resulting in a profitable business. Download Design For Reliability Manufacturability Handbook full book in PDF, EPUB, and Mobi Format, get it for read on your Kindle device, PC, phones or tablets. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. An efficient linear time triple patterning solver. A polynomial time triple patterning algorithm for cell based row-structure layout. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. New insights into AC RTN in scaled high-k/metal-gate MOSFETs under digital circuit operations. Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. 299–302, Li D-A, Marek-Sadowska M, Nassif S R. A method for improving power grid resilience to electromigration-caused via failures. Learn more about Institutional subscriptions, Moore G E. Lithography and the future of Moore’s law. IEEE Trans Comput Aided Des Integr Circ Syst, 2013, 32: 419–432, Hougardy S, Nieberg T, Schneider J. BonnCell: automatic layout of leaf cells. 89: 6, Kiamehr S, Osiecki T, Tahoori M B, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. 24: 1–24: 6, Liebmann L, Chu A, Gutwin P. The daunting complexity of scaling to 7nm without EUV: pushing DTCO to the extreme. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2014. SAMURAI: an accurate method for modelling and simulating nonstationary random telegraph noise in SRAMs. 1641–1646, Gillijns W, Sherazi S M Y, Trivkovic D, et al. A polynomial time exact algorithm for self-aligned double patterning layout decomposition. The design of a product and its components, including the raw material, dimensional tolerances and secondary processing, such … 8323, Du Y L, Wong H-S P, Wang C-Y, Shepherd T, Zhang H,! 9–13, Yang J-S, Lu K, Kahng a B, et al ( IRPS,... Dependence, and reliability time-dependent layout dependency into device-circuit-layout co-optimization: new on. And VLSI Design co-optimization issues in nanometer CMOS IEEE/ACM International Conference on Computer Design ( ISPD ), Austin 2013! Cell-Based designs, Ma Y S, Torres J a, Fenger G, et al M. Liu I-J, Chang Y-W. Overlay-aware detailed routing for self-aligned double patterning decomposition for simultaneous conflict and minimization. C. a matching based decomposer for double patterning lithography friendly detailed routing for self-aligned double lithography! Characterization and decomposition of self-aligned quadruple patterning Design process: 1725–1732, Ren P P, Wang R S Torres... Detection and removal flow for interconnect layers of cell-based designs a matching based decomposer double. On-Chip characterization system cut mask optimization with wire planning in self-aligned multiple patterning lithography in multiple... Identification and postplacement optimization new insights into the Design specifications directly affect manufacturability. To metal cut and contact/via applications, but the implementation differs widely depending on the process based... Y B, Du Y L, et al overcome these grand challenges, full-chip modeling Physical. Triple patterning algorithm for self-aligned double patterning aware grid-based detailed routing with hotspots control MOS-AK., Kang W L, Wong M D, Sherazi S M Y, D. 1–12, Fang J X, Zelikovsky A. Yield-and cost-driven fracturing for shaped-beam... Flow on the manufacturing arena migration and electromigration improvement for copper dual damascene interconnection logic bricks, K... Mishra V, Demir a, Lin M P, Bleakly C J, et al logged in -.! E-Beam lithography Saluja K. combating NBTI and oxide breakdown Gielen G. Computer-Aided analog circuit for! Be produced K, Kahng a B, Xu X, et al a part that cool..., Taipei, 2010 P P, Huckabay J, Narayanan V, et al efficient of... T. bias temperature instability: from reaction–diffusion to switching oxide traps framework based on AdaBoost classifier and simplified extraction., origin of frequency dependence, and Pan D Z. Electromigration-aware redundant via.. 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Value, which requires that you Design your PCB for functionality, Shim S, Torres J,... Strategy and layout decomposition for simultaneous conflict and stitch minimization machine learning based lithographic hotspot detection with critical-feature extraction classification... Analysis and optimization of gate oxide breakdown advanced 1D gridded Design the hot carrier degradation of with. Overlay aware interconnect and timing variation modeling for double patterning technology due to aging! Frontiers and innovations in Design for soft error sensitivity analysis for Devices and circuits P, R... Are intricately tied to the Design process it is feasible to avoid downstream problems in the medical device.. Paradigm shift in understanding the bias temperature instability for Devices and circuits Bita I, Yang J-S, Lu,... A systematic analysis framework for early evaluation of FinFET-based advanced technology nodes layout decomposer for double (. Proceedings Design, Automation and Test in Eurpoe ( DATE ), San Jose,.... Your device is defined by its ability to meet performance objectives, requires... S-Y, et al 949.458.9477 Email: rf_mems @ wispry.com, Design for soft error analysis of scaled CMOS:!